Thermal management method including a metallic layer directly on an integrated heat spreader and integrated circuit

An apparatus, method, and system for providing thermal management for an integrated circuit includes a first metallic layer directly placed on a back surface of the integrated circuit. An integrated heat spreader with a substantially cap-like shape is placed over the integrated circuit, with an aper...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN CHEE KOANG, SIR JIUN HANN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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