Surface mountable integrated circuit packaging scheme

An integrated circuit (IC) package is disclosed. The IC package includes a substrate having top, middle and bottom layers, an array of millimeter-wave antennas embedded on the top layer of the substrate and a monolithic microwave integrated circuit (MMIC) mounted on the bottom layer of the substrate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DOAN CHINH HUY, ALI MOHAMMED ERSHAD
Format:	Patent
Sprache:	eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRICITY
Online-Zugang:	Volltext bestellen
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