Lithographic projection apparatus, device manufacturing method and device manufactured thereby

A lithographic projection apparatus comprising a radiation system for supplying a projection beam of electromagnetic radiation in the extreme ultraviolet (EUV) range, a support structure for supporting patterning structure, the patterning structure serving to pattern the projection beam according to...

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Hauptverfasser: JONKERS JEROEN, BANINE VADIM Y
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creator JONKERS JEROEN
BANINE VADIM Y
description A lithographic projection apparatus comprising a radiation system for supplying a projection beam of electromagnetic radiation in the extreme ultraviolet (EUV) range, a support structure for supporting patterning structure, the patterning structure serving to pattern the projection beam according to a desired pattern, a substrate table for holding a substrate and a projection system for projecting the patterned beam onto a target portion of the substrate. A space within the apparatus, which space contains a mirror, is supplied with a hydrocarbon gas which forms a protective cap layer on the mirror surface. The partial pressure of the hydrocarbon gas in the space is controlled in response to variations in the background pressure in the space and/or in the reflectivity of the mirror, such that the thickness of the cap layer on the mirror remains within an acceptable range. The partial pressure of hydrocarbon may be increased in order to sputter away the cap layer and/or, if extra multilayers are provided on the mirror, the top layer(s) of the mirror, thus providing a clean mirror surface. The hydrocarbon used may be an alcohol, in which case the cap layer formed is self-terminating.
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A space within the apparatus, which space contains a mirror, is supplied with a hydrocarbon gas which forms a protective cap layer on the mirror surface. The partial pressure of the hydrocarbon gas in the space is controlled in response to variations in the background pressure in the space and/or in the reflectivity of the mirror, such that the thickness of the cap layer on the mirror remains within an acceptable range. The partial pressure of hydrocarbon may be increased in order to sputter away the cap layer and/or, if extra multilayers are provided on the mirror, the top layer(s) of the mirror, thus providing a clean mirror surface. 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A space within the apparatus, which space contains a mirror, is supplied with a hydrocarbon gas which forms a protective cap layer on the mirror surface. The partial pressure of the hydrocarbon gas in the space is controlled in response to variations in the background pressure in the space and/or in the reflectivity of the mirror, such that the thickness of the cap layer on the mirror remains within an acceptable range. The partial pressure of hydrocarbon may be increased in order to sputter away the cap layer and/or, if extra multilayers are provided on the mirror, the top layer(s) of the mirror, thus providing a clean mirror surface. 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A space within the apparatus, which space contains a mirror, is supplied with a hydrocarbon gas which forms a protective cap layer on the mirror surface. The partial pressure of the hydrocarbon gas in the space is controlled in response to variations in the background pressure in the space and/or in the reflectivity of the mirror, such that the thickness of the cap layer on the mirror remains within an acceptable range. The partial pressure of hydrocarbon may be increased in order to sputter away the cap layer and/or, if extra multilayers are provided on the mirror, the top layer(s) of the mirror, thus providing a clean mirror surface. The hydrocarbon used may be an alcohol, in which case the cap layer formed is self-terminating.</abstract><oa>free_for_read</oa></addata></record>
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subjects ACCESSORIES THEREFOR
APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES
APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
CINEMATOGRAPHY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
MATERIALS THEREFOR
METALLURGY
MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
title Lithographic projection apparatus, device manufacturing method and device manufactured thereby
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