Method for forming and sealing a cavity for an integrated MEMS device

Method for forming and sealing a cavity for an integrated MEMS device

A method is provided for constructing a microelectronic assembly. A semiconductor substrate having a MEMS device formed on a first portion thereof, a semiconductor device formed on a second portion thereof, and a build up layer having a first portion formed over the MEMS device and a second portion...

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Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SEMICONDUCTOR DEVICES
TRANSPORTING
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description A method is provided for constructing a microelectronic assembly. A semiconductor substrate having a MEMS device formed on a first portion thereof, a semiconductor device formed on a second portion thereof, and a build up layer having a first portion formed over the MEMS device and a second portion formed over the semiconductor device is provided. The first portion of the build up layer over the MEMS device is removed. A release body is formed adjacent to the MEMS device. A structural material is formed over the release body. An opening is formed in the structural material to expose the release body. The release body is removed through the opening to form a cavity between the MEMS device and the structural material. The opening in the structural material is sealed with a sealing material.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SEMICONDUCTOR DEVICES
TRANSPORTING
title Method for forming and sealing a cavity for an integrated MEMS device
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