Integrated circuit shield structure

Embodiments of the invention provide an integrated circuit structure comprising: a substrate; a shield structure comprising a shield member and a ground strap formed on the substrate, wherein the shield member comprises a non-metallic portion, and the ground strap comprises a metallic portion.

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Bibliographische Detailangaben
Hauptverfasser: LIM SUH FEI, CHENG MICHAEL CHYE HUAT, CHEW KOK WAI, CHU SANFORD SHAO-FU
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Embodiments of the invention provide an integrated circuit structure comprising: a substrate; a shield structure comprising a shield member and a ground strap formed on the substrate, wherein the shield member comprises a non-metallic portion, and the ground strap comprises a metallic portion.