Semiconductor device, fabricating method thereof, and photomask
There is provided a semiconductor device including a wafer and a focus monitoring pattern formed on the wafer. The focus monitoring pattern having at least one pair of first and second patterns, and the first pattern has an unexposed region surrounded by an exposed region, and the second pattern has...
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creator | TAKAHARA MIKA TOYODA SHIGEHIRO HIGASHI TOHRU |
description | There is provided a semiconductor device including a wafer and a focus monitoring pattern formed on the wafer. The focus monitoring pattern having at least one pair of first and second patterns, and the first pattern has an unexposed region surrounded by an exposed region, and the second pattern has an exposed region surrounded by an unexposed region. In addition, the present invention provides a method of fabricating a semiconductor device comprising the steps of forming at least one pair of first and second patterns on a wafer, the first pattern having an unexposed region surrounded by an exposed region, the second pattern having an exposed region surrounded by an unexposed region, and checking a focusing condition on exposure by measuring widths of the first and second patterns formed on the wafer. |
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The focus monitoring pattern having at least one pair of first and second patterns, and the first pattern has an unexposed region surrounded by an exposed region, and the second pattern has an exposed region surrounded by an unexposed region. In addition, the present invention provides a method of fabricating a semiconductor device comprising the steps of forming at least one pair of first and second patterns on a wafer, the first pattern having an unexposed region surrounded by an exposed region, the second pattern having an exposed region surrounded by an unexposed region, and checking a focusing condition on exposure by measuring widths of the first and second patterns formed on the wafer.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; AUXILIARY PROCESSES IN PHOTOGRAPHY ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES ; PHYSICS</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100126&DB=EPODOC&CC=US&NR=7651826B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100126&DB=EPODOC&CC=US&NR=7651826B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKAHARA MIKA</creatorcontrib><creatorcontrib>TOYODA SHIGEHIRO</creatorcontrib><creatorcontrib>HIGASHI TOHRU</creatorcontrib><title>Semiconductor device, fabricating method thereof, and photomask</title><description>There is provided a semiconductor device including a wafer and a focus monitoring pattern formed on the wafer. 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In addition, the present invention provides a method of fabricating a semiconductor device comprising the steps of forming at least one pair of first and second patterns on a wafer, the first pattern having an unexposed region surrounded by an exposed region, the second pattern having an exposed region surrounded by an unexposed region, and checking a focusing condition on exposure by measuring widths of the first and second patterns formed on the wafer.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>AUXILIARY PROCESSES IN PHOTOGRAPHY</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAPTs3NTM7PSylNLskvUkhJLctMTtVRSEtMKspMTizJzEtXyE0tychPUSjJSC1KzU_TUUjMS1EoyMgvyc9NLM7mYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocHmZqaGFkZmTkbGRCgBAEf4MNY</recordid><startdate>20100126</startdate><enddate>20100126</enddate><creator>TAKAHARA MIKA</creator><creator>TOYODA SHIGEHIRO</creator><creator>HIGASHI TOHRU</creator><scope>EVB</scope></search><sort><creationdate>20100126</creationdate><title>Semiconductor device, fabricating method thereof, and photomask</title><author>TAKAHARA MIKA ; TOYODA SHIGEHIRO ; HIGASHI TOHRU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7651826B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>AUXILIARY PROCESSES IN PHOTOGRAPHY</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKAHARA MIKA</creatorcontrib><creatorcontrib>TOYODA SHIGEHIRO</creatorcontrib><creatorcontrib>HIGASHI TOHRU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKAHARA MIKA</au><au>TOYODA SHIGEHIRO</au><au>HIGASHI TOHRU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor device, fabricating method thereof, and photomask</title><date>2010-01-26</date><risdate>2010</risdate><abstract>There is provided a semiconductor device including a wafer and a focus monitoring pattern formed on the wafer. The focus monitoring pattern having at least one pair of first and second patterns, and the first pattern has an unexposed region surrounded by an exposed region, and the second pattern has an exposed region surrounded by an unexposed region. In addition, the present invention provides a method of fabricating a semiconductor device comprising the steps of forming at least one pair of first and second patterns on a wafer, the first pattern having an unexposed region surrounded by an exposed region, the second pattern having an exposed region surrounded by an unexposed region, and checking a focusing condition on exposure by measuring widths of the first and second patterns formed on the wafer.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS SPECIALLY ADAPTED THEREFOR AUXILIARY PROCESSES IN PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES PHYSICS |
title | Semiconductor device, fabricating method thereof, and photomask |
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