Semiconductor devices having a back surface protective coating

A wafer level method of forming a protective coating on the back surface of integrated circuit devices is described. In one aspect, a tape having a backcoat layer and a mount layer is applied to the back surface of a wafer. The backcoat layer is cured or set such that the backcoat layer is affixed t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PATWARDHAN VIRAJ A, KELKAR NIKHIL VISHWANATH, TAN LIAN HEE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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