Method of forming a housing for an electronic device

The described embodiments relate to electronic devices. One exemplary device includes a pair of sidewall components extending between respective top portions and bottom portions, the bottom portions lying in a plane that extends between the bottom portions. The device also includes a bottom componen...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAY, JR. THOMAS A, VARGHESE PAILY T, HASTINGS ROBERT J
Format: Patent
Sprache:eng
Schlagworte:
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