Semiconductor device

A semiconductor device includes a semiconductor substrate, an insulating film formed above an upper surface of the substrate and including a contact hole penetrating the insulating film, a wiring portion formed on the insulating film, and a contact plug formed in the contact hole and including a fir...

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1. Verfasser:	NISHIMURA TAKAHARU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	NISHIMURA TAKAHARU
description	A semiconductor device includes a semiconductor substrate, an insulating film formed above an upper surface of the substrate and including a contact hole penetrating the insulating film, a wiring portion formed on the insulating film, and a contact plug formed in the contact hole and including a first conductive plug formed in a lower portion of the contact hole so that the exposed upper surface of the semiconductor substrate is in contact with the first conductive plug and a second conductive plug formed on the first conductive plug, so that the wiring portion is in contact with the second conductive plug. The first and second conductive plugs have an interface with a height that is lower than a height of the boundary portion relative to an upper surface of the semiconductor substrate.
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	Semiconductor device
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