Interconnect structure
A structure. The structure includes: a core electrical conductor having a top surface, an opposite bottom surface and sides between the top and bottom surfaces; an electrically conductive liner in direct physical contact with and covering the bottom surface and the sides of the core electrical condu...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | COWLEY ANDREW P CLEVENGER LAWRENCE A YANG CHIHAO DALTON TIMOTHY J YOON MEEYOUNG H |
| description | A structure. The structure includes: a core electrical conductor having a top surface, an opposite bottom surface and sides between the top and bottom surfaces; an electrically conductive liner in direct physical contact with and covering the bottom surface and the sides of the core electrical conductor, embedded portions of the electrically conductive liner in direct physical contact with and extending over the core electrical conductor in regions of the core electrical conductor adjacent to both the top surface and the sides of the core electrical conductor; and an electrically conductive cap in direct physical contact with the top surface of the core electrical conductor that is exposed between the embedded portions of the electrically conductive liner. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US7598616B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US7598616B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US7598616B23</originalsourceid><addsrcrecordid>eNrjZBDzzCtJLUrOz8tLTS5RKC4pKk0uKS1K5WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8aHB5qaWFmaGZk5GxkQoAQCVxSHg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Interconnect structure</title><source>esp@cenet</source><creator>COWLEY ANDREW P ; CLEVENGER LAWRENCE A ; YANG CHIHAO ; DALTON TIMOTHY J ; YOON MEEYOUNG H</creator><creatorcontrib>COWLEY ANDREW P ; CLEVENGER LAWRENCE A ; YANG CHIHAO ; DALTON TIMOTHY J ; YOON MEEYOUNG H</creatorcontrib><description>A structure. The structure includes: a core electrical conductor having a top surface, an opposite bottom surface and sides between the top and bottom surfaces; an electrically conductive liner in direct physical contact with and covering the bottom surface and the sides of the core electrical conductor, embedded portions of the electrically conductive liner in direct physical contact with and extending over the core electrical conductor in regions of the core electrical conductor adjacent to both the top surface and the sides of the core electrical conductor; and an electrically conductive cap in direct physical contact with the top surface of the core electrical conductor that is exposed between the embedded portions of the electrically conductive liner.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20091006&DB=EPODOC&CC=US&NR=7598616B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20091006&DB=EPODOC&CC=US&NR=7598616B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>COWLEY ANDREW P</creatorcontrib><creatorcontrib>CLEVENGER LAWRENCE A</creatorcontrib><creatorcontrib>YANG CHIHAO</creatorcontrib><creatorcontrib>DALTON TIMOTHY J</creatorcontrib><creatorcontrib>YOON MEEYOUNG H</creatorcontrib><title>Interconnect structure</title><description>A structure. The structure includes: a core electrical conductor having a top surface, an opposite bottom surface and sides between the top and bottom surfaces; an electrically conductive liner in direct physical contact with and covering the bottom surface and the sides of the core electrical conductor, embedded portions of the electrically conductive liner in direct physical contact with and extending over the core electrical conductor in regions of the core electrical conductor adjacent to both the top surface and the sides of the core electrical conductor; and an electrically conductive cap in direct physical contact with the top surface of the core electrical conductor that is exposed between the embedded portions of the electrically conductive liner.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBDzzCtJLUrOz8tLTS5RKC4pKk0uKS1K5WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8aHB5qaWFmaGZk5GxkQoAQCVxSHg</recordid><startdate>20091006</startdate><enddate>20091006</enddate><creator>COWLEY ANDREW P</creator><creator>CLEVENGER LAWRENCE A</creator><creator>YANG CHIHAO</creator><creator>DALTON TIMOTHY J</creator><creator>YOON MEEYOUNG H</creator><scope>EVB</scope></search><sort><creationdate>20091006</creationdate><title>Interconnect structure</title><author>COWLEY ANDREW P ; CLEVENGER LAWRENCE A ; YANG CHIHAO ; DALTON TIMOTHY J ; YOON MEEYOUNG H</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7598616B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>COWLEY ANDREW P</creatorcontrib><creatorcontrib>CLEVENGER LAWRENCE A</creatorcontrib><creatorcontrib>YANG CHIHAO</creatorcontrib><creatorcontrib>DALTON TIMOTHY J</creatorcontrib><creatorcontrib>YOON MEEYOUNG H</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>COWLEY ANDREW P</au><au>CLEVENGER LAWRENCE A</au><au>YANG CHIHAO</au><au>DALTON TIMOTHY J</au><au>YOON MEEYOUNG H</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Interconnect structure</title><date>2009-10-06</date><risdate>2009</risdate><abstract>A structure. The structure includes: a core electrical conductor having a top surface, an opposite bottom surface and sides between the top and bottom surfaces; an electrically conductive liner in direct physical contact with and covering the bottom surface and the sides of the core electrical conductor, embedded portions of the electrically conductive liner in direct physical contact with and extending over the core electrical conductor in regions of the core electrical conductor adjacent to both the top surface and the sides of the core electrical conductor; and an electrically conductive cap in direct physical contact with the top surface of the core electrical conductor that is exposed between the embedded portions of the electrically conductive liner.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US7598616B2 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Interconnect structure |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-02T13%3A20%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=COWLEY%20ANDREW%20P&rft.date=2009-10-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS7598616B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |