Package design of small diameter sensor

A small sensor assembly is produced by encapsulating an inner package within an outer package. The inner assembly can have electrical components and sensors attached to a lead frame. The electrical components can be protected within inner packages that have alignment indentations. The alignment inde...

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Bibliographische Detailangaben

Hauptverfasser:	MAXWELL ABANNL B, EATON WILLIAM F, MICHELHAUGH SCOTT E, MEYERS AARON J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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