Package design of small diameter sensor
A small sensor assembly is produced by encapsulating an inner package within an outer package. The inner assembly can have electrical components and sensors attached to a lead frame. The electrical components can be protected within inner packages that have alignment indentations. The alignment inde...
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| creator | MAXWELL ABANNL B EATON WILLIAM F MICHELHAUGH SCOTT E MEYERS AARON J |
| description | A small sensor assembly is produced by encapsulating an inner package within an outer package. The inner assembly can have electrical components and sensors attached to a lead frame. The electrical components can be protected within inner packages that have alignment indentations. The alignment indentations are positioned over the outside edges of the lead frame and, preferably, no electrical components directly underlie the alignment indentations. The inner assembly is held in alignment by movable pins within a mold into which plastic is flowed. The mold is configured to cause some of the plastic to set earlier than the rest of the plastic and to hold the inner assembly in alignment within the mold. The movable pins can be retracted once enough plastic has set to hold the inner assembly. Unset plastic can then flow into the alignment indentations. A sealed sensor assembly is formed once all the plastic has set. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US7592204B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US7592204B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US7592204B23</originalsourceid><addsrcrecordid>eNrjZFAPSEzOTkxPVUhJLc5Mz1PIT1Mozk3MyVFIyUzMTS1JLVIoTs0rzi_iYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocHmppZGRgYmTkbGRCgBADf4J3M</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Package design of small diameter sensor</title><source>esp@cenet</source><creator>MAXWELL ABANNL B ; EATON WILLIAM F ; MICHELHAUGH SCOTT E ; MEYERS AARON J</creator><creatorcontrib>MAXWELL ABANNL B ; EATON WILLIAM F ; MICHELHAUGH SCOTT E ; MEYERS AARON J</creatorcontrib><description>A small sensor assembly is produced by encapsulating an inner package within an outer package. The inner assembly can have electrical components and sensors attached to a lead frame. The electrical components can be protected within inner packages that have alignment indentations. The alignment indentations are positioned over the outside edges of the lead frame and, preferably, no electrical components directly underlie the alignment indentations. The inner assembly is held in alignment by movable pins within a mold into which plastic is flowed. The mold is configured to cause some of the plastic to set earlier than the rest of the plastic and to hold the inner assembly in alignment within the mold. The movable pins can be retracted once enough plastic has set to hold the inner assembly. Unset plastic can then flow into the alignment indentations. A sealed sensor assembly is formed once all the plastic has set.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090922&DB=EPODOC&CC=US&NR=7592204B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76304</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090922&DB=EPODOC&CC=US&NR=7592204B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MAXWELL ABANNL B</creatorcontrib><creatorcontrib>EATON WILLIAM F</creatorcontrib><creatorcontrib>MICHELHAUGH SCOTT E</creatorcontrib><creatorcontrib>MEYERS AARON J</creatorcontrib><title>Package design of small diameter sensor</title><description>A small sensor assembly is produced by encapsulating an inner package within an outer package. The inner assembly can have electrical components and sensors attached to a lead frame. The electrical components can be protected within inner packages that have alignment indentations. The alignment indentations are positioned over the outside edges of the lead frame and, preferably, no electrical components directly underlie the alignment indentations. The inner assembly is held in alignment by movable pins within a mold into which plastic is flowed. The mold is configured to cause some of the plastic to set earlier than the rest of the plastic and to hold the inner assembly in alignment within the mold. The movable pins can be retracted once enough plastic has set to hold the inner assembly. Unset plastic can then flow into the alignment indentations. A sealed sensor assembly is formed once all the plastic has set.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAPSEzOTkxPVUhJLc5Mz1PIT1Mozk3MyVFIyUzMTS1JLVIoTs0rzi_iYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocHmppZGRgYmTkbGRCgBADf4J3M</recordid><startdate>20090922</startdate><enddate>20090922</enddate><creator>MAXWELL ABANNL B</creator><creator>EATON WILLIAM F</creator><creator>MICHELHAUGH SCOTT E</creator><creator>MEYERS AARON J</creator><scope>EVB</scope></search><sort><creationdate>20090922</creationdate><title>Package design of small diameter sensor</title><author>MAXWELL ABANNL B ; EATON WILLIAM F ; MICHELHAUGH SCOTT E ; MEYERS AARON J</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7592204B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>MAXWELL ABANNL B</creatorcontrib><creatorcontrib>EATON WILLIAM F</creatorcontrib><creatorcontrib>MICHELHAUGH SCOTT E</creatorcontrib><creatorcontrib>MEYERS AARON J</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MAXWELL ABANNL B</au><au>EATON WILLIAM F</au><au>MICHELHAUGH SCOTT E</au><au>MEYERS AARON J</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Package design of small diameter sensor</title><date>2009-09-22</date><risdate>2009</risdate><abstract>A small sensor assembly is produced by encapsulating an inner package within an outer package. The inner assembly can have electrical components and sensors attached to a lead frame. The electrical components can be protected within inner packages that have alignment indentations. The alignment indentations are positioned over the outside edges of the lead frame and, preferably, no electrical components directly underlie the alignment indentations. The inner assembly is held in alignment by movable pins within a mold into which plastic is flowed. The mold is configured to cause some of the plastic to set earlier than the rest of the plastic and to hold the inner assembly in alignment within the mold. The movable pins can be retracted once enough plastic has set to hold the inner assembly. Unset plastic can then flow into the alignment indentations. A sealed sensor assembly is formed once all the plastic has set.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | Package design of small diameter sensor |
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