Stencil and method for depositing material onto a substrate
A stencil and method for depositing a coupon of underfill material onto a substrate that is to receive an integrated circuit die.
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| creator | WATSON JEFFREY R |
| description | A stencil and method for depositing a coupon of underfill material onto a substrate that is to receive an integrated circuit die. |
| format | Patent |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Stencil and method for depositing material onto a substrate |
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