Method and apparatus for processing a wafer

A method of a single wafer wet/dry cleaning apparatus comprising: a transfer chamber having a wafer handler contained therein; a first single wafer wet cleaning chamber directly coupled to the transfer chamber; and a first single wafer ashing chamber directly coupled to the transfer chamber.

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Bibliographische Detailangaben
Hauptverfasser: TRUMAN J KELLY, SOMEKH SASSON R, VERHAVERBEKE STEVEN, LANE CHRISTOPHER T
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A method of a single wafer wet/dry cleaning apparatus comprising: a transfer chamber having a wafer handler contained therein; a first single wafer wet cleaning chamber directly coupled to the transfer chamber; and a first single wafer ashing chamber directly coupled to the transfer chamber.