Method of making device for solid state thermal transfer and power generation
A method of making a solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. The solid state thermal transfer device also includes a sealing layer disposed between the first and second electrically conductive sub...
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creator | WEAVER, JR. STANTON EARL WOJNAROWSKI ROBERT JOHN |
description | A method of making a solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. The solid state thermal transfer device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates. |
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STANTON EARL ; WOJNAROWSKI ROBERT JOHN</creatorcontrib><description>A method of making a solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. 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STANTON EARL</creatorcontrib><creatorcontrib>WOJNAROWSKI ROBERT JOHN</creatorcontrib><title>Method of making device for solid state thermal transfer and power generation</title><description>A method of making a solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. The solid state thermal transfer device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.</description><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyjEOwjAQBVE3FAi4w16AJhGyaEEgmlRAHa3i78TC8Vr2Cq5PCg5ANVO8tek66CSOxNPMr5BGcniHAeSlUJUYHFVlBemEMnMkLZyqRyFOjrJ8lhuRUFiDpK1ZeY4Vu183hq6Xx_m2R5YeNfOwUO2fd3uwzdG2p6b9g3wBWw019A</recordid><startdate>20090811</startdate><enddate>20090811</enddate><creator>WEAVER, JR. 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STANTON EARL</creatorcontrib><creatorcontrib>WOJNAROWSKI ROBERT JOHN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WEAVER, JR. STANTON EARL</au><au>WOJNAROWSKI ROBERT JOHN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of making device for solid state thermal transfer and power generation</title><date>2009-08-11</date><risdate>2009</risdate><abstract>A method of making a solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. The solid state thermal transfer device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION |
title | Method of making device for solid state thermal transfer and power generation |
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