Semiconductor chip and semiconductor device

In the peripheral part of a semiconductor chip, third electrode pads for wire bonding and plate wiring and first electrode pads dedicated to wire bonding are provided. On the other hand, second electrode pads dedicated to plate wiring are provided on an inner part away from the edge of the semicondu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MORI HARUYA, NAKANISHI HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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