Securing heat sinks to a device under test
Apparatus and method for securing a heat sink to a heat-generating device on a circuit board. The apparatus clamps onto the heating-generating device and the circuit board in a manner that avoids bending of the circuit board. The apparatus includes a retention module having a plurality of retention...
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| creator | HERRING DEAN FREDERICK DESROSIERS NORMAN BRUCE KELAHER DANIEL PAUL WORMSBECHER PAUL ANDREW FRENCH, JR. MICHAEL DUDLEY |
| description | Apparatus and method for securing a heat sink to a heat-generating device on a circuit board. The apparatus clamps onto the heating-generating device and the circuit board in a manner that avoids bending of the circuit board. The apparatus includes a retention module having a plurality of retention features that extend through openings in the circuit board disposed about the perimeter of the heat-generating device, such as a processor. The apparatus also includes a heat sink having a heat sink base for contacting the heat-generating device in order to dissipate heat produced by the device. The heat sink is selectively securable to the retention features of the retention module using levers, such as a wire module, having a spring clip to engage the retention features and clamp the heat sink and retention module together. |
| format | Patent |
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MICHAEL DUDLEY</creatorcontrib><description>Apparatus and method for securing a heat sink to a heat-generating device on a circuit board. The apparatus clamps onto the heating-generating device and the circuit board in a manner that avoids bending of the circuit board. The apparatus includes a retention module having a plurality of retention features that extend through openings in the circuit board disposed about the perimeter of the heat-generating device, such as a processor. The apparatus also includes a heat sink having a heat sink base for contacting the heat-generating device in order to dissipate heat produced by the device. The heat sink is selectively securable to the retention features of the retention module using levers, such as a wire module, having a spring clip to engage the retention features and clamp the heat sink and retention module together.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEATING ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; MECHANICAL ENGINEERING ; PHYSICS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; TESTING ; WEAPONS</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090414&DB=EPODOC&CC=US&NR=7518875B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090414&DB=EPODOC&CC=US&NR=7518875B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HERRING DEAN FREDERICK</creatorcontrib><creatorcontrib>DESROSIERS NORMAN BRUCE</creatorcontrib><creatorcontrib>KELAHER DANIEL PAUL</creatorcontrib><creatorcontrib>WORMSBECHER PAUL ANDREW</creatorcontrib><creatorcontrib>FRENCH, JR. MICHAEL DUDLEY</creatorcontrib><title>Securing heat sinks to a device under test</title><description>Apparatus and method for securing a heat sink to a heat-generating device on a circuit board. The apparatus clamps onto the heating-generating device and the circuit board in a manner that avoids bending of the circuit board. The apparatus includes a retention module having a plurality of retention features that extend through openings in the circuit board disposed about the perimeter of the heat-generating device, such as a processor. The apparatus also includes a heat sink having a heat sink base for contacting the heat-generating device in order to dissipate heat produced by the device. The heat sink is selectively securable to the retention features of the retention module using levers, such as a wire module, having a spring clip to engage the retention features and clamp the heat sink and retention module together.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>MECHANICAL ENGINEERING</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAKTk0uLcrMS1fISE0sUSjOzMsuVijJV0hUSEkty0xOVSjNS0ktUihJLS7hYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocHmpoYWFuamTkbGRCgBALe4KHE</recordid><startdate>20090414</startdate><enddate>20090414</enddate><creator>HERRING DEAN FREDERICK</creator><creator>DESROSIERS NORMAN BRUCE</creator><creator>KELAHER DANIEL PAUL</creator><creator>WORMSBECHER PAUL ANDREW</creator><creator>FRENCH, JR. 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MICHAEL DUDLEY</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7518875B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>MECHANICAL ENGINEERING</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>HERRING DEAN FREDERICK</creatorcontrib><creatorcontrib>DESROSIERS NORMAN BRUCE</creatorcontrib><creatorcontrib>KELAHER DANIEL PAUL</creatorcontrib><creatorcontrib>WORMSBECHER PAUL ANDREW</creatorcontrib><creatorcontrib>FRENCH, JR. MICHAEL DUDLEY</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HERRING DEAN FREDERICK</au><au>DESROSIERS NORMAN BRUCE</au><au>KELAHER DANIEL PAUL</au><au>WORMSBECHER PAUL ANDREW</au><au>FRENCH, JR. MICHAEL DUDLEY</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Securing heat sinks to a device under test</title><date>2009-04-14</date><risdate>2009</risdate><abstract>Apparatus and method for securing a heat sink to a heat-generating device on a circuit board. The apparatus clamps onto the heating-generating device and the circuit board in a manner that avoids bending of the circuit board. The apparatus includes a retention module having a plurality of retention features that extend through openings in the circuit board disposed about the perimeter of the heat-generating device, such as a processor. The apparatus also includes a heat sink having a heat sink base for contacting the heat-generating device in order to dissipate heat produced by the device. The heat sink is selectively securable to the retention features of the retention module using levers, such as a wire module, having a spring clip to engage the retention features and clamp the heat sink and retention module together.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES MECHANICAL ENGINEERING PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TESTING WEAPONS |
| title | Securing heat sinks to a device under test |
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