Methods of forming wire bonds for semiconductor constructions

The invention includes a semiconductor construction having a wire bonding region associated with a metal-containing layer, and having radiation-imageable material over the metal-containing layer. The radiation-imageable material can be configured as a multi-level pattern having a first topographical...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	RICHARDS JOSEPH M, ROLTSON J. BRETT, DRYNAN JOHN M, AITON JOHN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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