Integrated circuit having bond pad with improved thermal and mechanical properties

Integrated circuit having bond pad with improved thermal and mechanical properties

An integrated circuit includes active circuitry and at least one bond pad. The at least one bond pad, in turn, comprises a metallization layer and a capping layer having one or more grooves. The metallization layer is in electrical contact with at least a portion of the active circuitry. In addition...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: RYAN VIVIAN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator RYAN VIVIAN
description An integrated circuit includes active circuitry and at least one bond pad. The at least one bond pad, in turn, comprises a metallization layer and a capping layer having one or more grooves. The metallization layer is in electrical contact with at least a portion of the active circuitry. In addition, the capping layer is formed over at least a portion of the metallization layer and is in electrical contact with the metallization layer. The grooves in the capping layer may be located only proximate to the edges of the bond pad or may run throughout the bond pad depending on the application.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US7504728B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US7504728B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US7504728B23</originalsourceid><addsrcrecordid>eNqNijsKAjEQQNNYiHqHuYAgq7LWiqKtn3oZk3EzsPkwGdfrm8IDWD0e703N9RKVekElB5bFvlnB48ixh2eKDjI6-LB64JAljfVSTxJwAKw1kPUY2VatNZMoU5mbyQuHQosfZwZOx_vhvKScOioZLUXS7nFrt6tN2-z2zfqP5QvRRzgw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Integrated circuit having bond pad with improved thermal and mechanical properties</title><source>esp@cenet</source><creator>RYAN VIVIAN</creator><creatorcontrib>RYAN VIVIAN</creatorcontrib><description>An integrated circuit includes active circuitry and at least one bond pad. The at least one bond pad, in turn, comprises a metallization layer and a capping layer having one or more grooves. The metallization layer is in electrical contact with at least a portion of the active circuitry. In addition, the capping layer is formed over at least a portion of the metallization layer and is in electrical contact with the metallization layer. The grooves in the capping layer may be located only proximate to the edges of the bond pad or may run throughout the bond pad depending on the application.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20090317&amp;DB=EPODOC&amp;CC=US&amp;NR=7504728B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20090317&amp;DB=EPODOC&amp;CC=US&amp;NR=7504728B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RYAN VIVIAN</creatorcontrib><title>Integrated circuit having bond pad with improved thermal and mechanical properties</title><description>An integrated circuit includes active circuitry and at least one bond pad. The at least one bond pad, in turn, comprises a metallization layer and a capping layer having one or more grooves. The metallization layer is in electrical contact with at least a portion of the active circuitry. In addition, the capping layer is formed over at least a portion of the metallization layer and is in electrical contact with the metallization layer. The grooves in the capping layer may be located only proximate to the edges of the bond pad or may run throughout the bond pad depending on the application.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNijsKAjEQQNNYiHqHuYAgq7LWiqKtn3oZk3EzsPkwGdfrm8IDWD0e703N9RKVekElB5bFvlnB48ixh2eKDjI6-LB64JAljfVSTxJwAKw1kPUY2VatNZMoU5mbyQuHQosfZwZOx_vhvKScOioZLUXS7nFrt6tN2-z2zfqP5QvRRzgw</recordid><startdate>20090317</startdate><enddate>20090317</enddate><creator>RYAN VIVIAN</creator><scope>EVB</scope></search><sort><creationdate>20090317</creationdate><title>Integrated circuit having bond pad with improved thermal and mechanical properties</title><author>RYAN VIVIAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7504728B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>RYAN VIVIAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RYAN VIVIAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Integrated circuit having bond pad with improved thermal and mechanical properties</title><date>2009-03-17</date><risdate>2009</risdate><abstract>An integrated circuit includes active circuitry and at least one bond pad. The at least one bond pad, in turn, comprises a metallization layer and a capping layer having one or more grooves. The metallization layer is in electrical contact with at least a portion of the active circuitry. In addition, the capping layer is formed over at least a portion of the metallization layer and is in electrical contact with the metallization layer. The grooves in the capping layer may be located only proximate to the edges of the bond pad or may run throughout the bond pad depending on the application.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US7504728B2
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Integrated circuit having bond pad with improved thermal and mechanical properties
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T23%3A47%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=RYAN%20VIVIAN&rft.date=2009-03-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS7504728B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true