Method of manufacturing an inverter device

By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semicondu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: OBU TOSHIHARU, HAGIWARA KEIZO, TADA NOBUMITSU, YOSHIOKA SHIMPEI, SEKIYA HIROKI
Format: Patent
Sprache:eng
Schlagworte:
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