Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

A semiconductor device of the invention includes a semiconductor element (1), an interposer (5) having electrodes (2) arranged on a top face thereof in four directions and external electrodes (4) arranged on a bottom face thereof with the semiconductor element (1) mounted on the top face thereof, an...

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1. Verfasser: FUNAKOSHI MASASHI
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator FUNAKOSHI MASASHI
description A semiconductor device of the invention includes a semiconductor element (1), an interposer (5) having electrodes (2) arranged on a top face thereof in four directions and external electrodes (4) arranged on a bottom face thereof with the semiconductor element (1) mounted on the top face thereof, an adhesive material (6) fixing the semiconductor element (1) to the interposer (5), metal nanowires (7) electrically connecting between electrodes of the semiconductor element (1) and the electrodes (2) of the interposer (5), an insulating material (8) sealing a region containing the semiconductor element (1) and the metal nanowires (7), and metal balls (9) mounted on the external electrodes (4). Patterns (10) are designed on corners of a region surrounded by electrodes (2) arranged on the interposer (5) in four directions.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor device and manufacturing method thereof
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