Etch before grind for semiconductor die singulation

Methods are provided, and devices made by such methods. One of the methods includes procuring a semiconductor wafer, processing the wafer to form a plurality of circuits on a top side, forming trenches on the top side between the adjacent circuits, forming a trench passivation layer on side walls of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HORCH ANDREW E, PAULSEN RONALD E, MORRELL LARRY, KOEPP RONALD L, MA YANJUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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