Methods and apparatus for packaging integrated circuit devices

An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and semiconductor circuitry formed over the first generally planar surface, at least one chip scale packaging lay...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZILBER GIL, OGANESIAN VAGE, AKSENTON JULIA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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