Semiconductor device and a method of manufacturing the same

A semiconductor device comprising semiconductor chips each formed with plural pads at the main surface, chip parts each formed with connection terminals at both ends thereof, a module substrate on which the semiconductor chips and the chip parts are mounted, solder connection portions for connecting...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAKAJIMA HIROKAZU, KOIZUMI TOMOMICHI, ENDOH TSUNEO, MAEJIMA NOBUYOSHI, YAMADA TOMIO, NEGISHI MIKIO, YAMAURA MASASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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