Method of forming solder ball, and fabricating method and structure of semiconductor package using the same

A method of forming solder balls may involve forming bumps through wire boding on land patterns of a circuit substrate. Solder cream may be applied to the bumps through screen printing. The solder cream may be melted via reflow to form solder balls in which the bumps are embedded.

Bibliographische Detailangaben

Hauptverfasser:	KIM HEUI-SEOG, KIM JAE-HONG, JEON JONG-KEUN, SIN WHA-SU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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