Adhesive film removal method and apparatus

The present invention provides adhesive film removal methods and apparatus. The removal methods and apparatus involve apply tension over the width of the adhesive film, thereby removing the film from the substrate along the release line that extends over the width of the film. The methods and appara...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	STEELMAN RONALD S, ANDERSON CONRAD V, DAVID JOHN R
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CONVEYING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HANDLING THIN OR FILAMENTARY MATERIAL HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PACKING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS STORING TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention provides adhesive film removal methods and apparatus. The removal methods and apparatus involve apply tension over the width of the adhesive film, thereby removing the film from the substrate along the release line that extends over the width of the film. The methods and apparatus are particularly useful in removing large-scale graphic films from substrates such as truck trailers, vans, walls, signs and other large surfaces. The tension applied to the adhesive film during removal is preferably uniform across the width of the film, thereby reducing the risk of the film tearing or breaking during removal. The release line is advanced during removal along the length of the film until the entire film is removed from the substrate.