Semiconductor manufacturing apparatus having a built-in inspection apparatus and a device manufacturing method using said manufacturing apparatus

According to the present invention, a chemical and mechanical polishing apparatus ( 100 ) for a sample such as a wafer includes a built-in inspection apparatus ( 25 ) incorporated therein. The polishing apparatus ( 100 ) further comprises a load unit ( 21 ), a chemical and mechanical polishing unit...

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Bibliographische Detailangaben
Hauptverfasser: NOJI NOBUHARU, SATAKE TOHRU
Format: Patent
Sprache:eng
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