Controlled depth etched dielectric film

A dielectric film for use as a substrate for a flexible circuit comprises a polymer selected from the group consisting of liquid crystal polymers and polyimide copolymers including carboxylic ester structural units in the polymeric backbone. The dielectric film has a thickness from about 25 mum to a...

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Hauptverfasser: KREUTTER NATHAN P, DUNN CHRISTOPHER G, YANG RUI
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creator KREUTTER NATHAN P
DUNN CHRISTOPHER G
YANG RUI
description A dielectric film for use as a substrate for a flexible circuit comprises a polymer selected from the group consisting of liquid crystal polymers and polyimide copolymers including carboxylic ester structural units in the polymeric backbone. The dielectric film has a thickness from about 25 mum to about 60 mum including at least one thinned, recessed region wherein the thickness is reduced to less than 15 mum, as required for use of the dielectric film in e.g. ink jet print head, hard disk drive head gimbal assembly and touch sensor applications.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US7348045B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US7348045B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US7348045B23</originalsourceid><addsrcrecordid>eNrjZFB3zs8rKcrPyUlNUUhJLSjJUEgtSc4AcTJTc1KTS4oykxXSMnNyeRhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJfGiwubGJhYGJqZORMRFKAFooJ7Y</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Controlled depth etched dielectric film</title><source>esp@cenet</source><creator>KREUTTER NATHAN P ; DUNN CHRISTOPHER G ; YANG RUI</creator><creatorcontrib>KREUTTER NATHAN P ; DUNN CHRISTOPHER G ; YANG RUI</creatorcontrib><description>A dielectric film for use as a substrate for a flexible circuit comprises a polymer selected from the group consisting of liquid crystal polymers and polyimide copolymers including carboxylic ester structural units in the polymeric backbone. The dielectric film has a thickness from about 25 mum to about 60 mum including at least one thinned, recessed region wherein the thickness is reduced to less than 15 mum, as required for use of the dielectric film in e.g. ink jet print head, hard disk drive head gimbal assembly and touch sensor applications.</description><language>eng</language><subject>ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; POLISHES ; PRINTED CIRCUITS</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20080325&amp;DB=EPODOC&amp;CC=US&amp;NR=7348045B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20080325&amp;DB=EPODOC&amp;CC=US&amp;NR=7348045B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KREUTTER NATHAN P</creatorcontrib><creatorcontrib>DUNN CHRISTOPHER G</creatorcontrib><creatorcontrib>YANG RUI</creatorcontrib><title>Controlled depth etched dielectric film</title><description>A dielectric film for use as a substrate for a flexible circuit comprises a polymer selected from the group consisting of liquid crystal polymers and polyimide copolymers including carboxylic ester structural units in the polymeric backbone. The dielectric film has a thickness from about 25 mum to about 60 mum including at least one thinned, recessed region wherein the thickness is reduced to less than 15 mum, as required for use of the dielectric film in e.g. ink jet print head, hard disk drive head gimbal assembly and touch sensor applications.</description><subject>ADHESIVES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB3zs8rKcrPyUlNUUhJLSjJUEgtSc4AcTJTc1KTS4oykxXSMnNyeRhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJfGiwubGJhYGJqZORMRFKAFooJ7Y</recordid><startdate>20080325</startdate><enddate>20080325</enddate><creator>KREUTTER NATHAN P</creator><creator>DUNN CHRISTOPHER G</creator><creator>YANG RUI</creator><scope>EVB</scope></search><sort><creationdate>20080325</creationdate><title>Controlled depth etched dielectric film</title><author>KREUTTER NATHAN P ; DUNN CHRISTOPHER G ; YANG RUI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7348045B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2008</creationdate><topic>ADHESIVES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>KREUTTER NATHAN P</creatorcontrib><creatorcontrib>DUNN CHRISTOPHER G</creatorcontrib><creatorcontrib>YANG RUI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KREUTTER NATHAN P</au><au>DUNN CHRISTOPHER G</au><au>YANG RUI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Controlled depth etched dielectric film</title><date>2008-03-25</date><risdate>2008</risdate><abstract>A dielectric film for use as a substrate for a flexible circuit comprises a polymer selected from the group consisting of liquid crystal polymers and polyimide copolymers including carboxylic ester structural units in the polymeric backbone. The dielectric film has a thickness from about 25 mum to about 60 mum including at least one thinned, recessed region wherein the thickness is reduced to less than 15 mum, as required for use of the dielectric film in e.g. ink jet print head, hard disk drive head gimbal assembly and touch sensor applications.</abstract><oa>free_for_read</oa></addata></record>
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subjects ADHESIVES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
PRINTED CIRCUITS
title Controlled depth etched dielectric film
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T03%3A31%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KREUTTER%20NATHAN%20P&rft.date=2008-03-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS7348045B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true