Plating apparatus for substrate

The present invention provides a plating apparatus for a substrate which can plate a substrate under uniform pressure without increasing a load to be applied while holding the entire surface of a porous member in contact with the surface, to be plated, of the substrate. The plating apparatus for a s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAGAI MIZUKI, BAKER BRETT, KANDA HIROYUKI, DELIGIANNI HARIKLIA, KURASHINA KEIICHI, VEREECKEN PHILLIPE, YAMAMOTO SATORU, MISHIMA KOJI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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