One time programming memory cell using MOS device

An electroless plating apparatus is provided. The electroless plating apparatus includes a wafer holder; a chemical dispensing nozzle over the wafer holder; a conduit connected to the chemical dispensing nozzle; and a radiation source over the wafer holder.

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Bibliographische Detailangaben
Hauptverfasser: TSAI YUNG-SHENG, KO CHIN-YUAN, LIAO PEIUN
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An electroless plating apparatus is provided. The electroless plating apparatus includes a wafer holder; a chemical dispensing nozzle over the wafer holder; a conduit connected to the chemical dispensing nozzle; and a radiation source over the wafer holder.