Managed memory component

The present invention provides a system and method for combining a leaded package IC and a semiconductor die using a flex circuitry to reduce footprint for the combination. A leaded IC package is disposed along the obverse side of a flex circuit. In a preferred embodiment, leads of the leaded IC pac...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SZEWERENKO LELAND, PARTRIDGE JULIAN, ROPER DAVID L, WEHRLY, JR. JAMES DOUGLAS, ORRIS RON, ROY TIM
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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