Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same

A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is...

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Bibliographische Detailangaben

Hauptverfasser:	PATEL MITESH, LIM SHEAU HOOI, MARTIN EDWARD L, JAYARAMAN SAIKUMAR, CHIN YOONG TATT P, SUH DAEWOONG, BYRNE TIFFANY A, LOH WEI KEAT, LEHMAN STEPHEN E, BASIRON MOHD ERWAN B
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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