Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same

Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same

A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is...

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Hauptverfasser: PATEL MITESH, LIM SHEAU HOOI, MARTIN EDWARD L, JAYARAMAN SAIKUMAR, CHIN YOONG TATT P, SUH DAEWOONG, BYRNE TIFFANY A, LOH WEI KEAT, LEHMAN STEPHEN E, BASIRON MOHD ERWAN B
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator PATEL MITESH
LIM SHEAU HOOI
MARTIN EDWARD L
JAYARAMAN SAIKUMAR
CHIN YOONG TATT P
SUH DAEWOONG
BYRNE TIFFANY A
LOH WEI KEAT
LEHMAN STEPHEN E
BASIRON MOHD ERWAN B
description A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same
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