Method for making a micro-fluid ejection device

A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is ir...

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Hauptverfasser: VAIDEESWARAN KARTHIK, MRVOS JAMES M, HART BRIAN C, VANDERPOOL JASON T, PATIL GIRISH S, KRAWCZYK JOHN W, SINGH JEANNE M. SALDANHA, MONEY CHRISTOPHER J
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creator VAIDEESWARAN KARTHIK
MRVOS JAMES M
HART BRIAN C
VANDERPOOL JASON T
PATIL GIRISH S
KRAWCZYK JOHN W
SINGH JEANNE M. SALDANHA
MONEY CHRISTOPHER J
description A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is irradiated to assist in post etch stripping of the etch mask layer from the select second area. The substrate is etched to form fluid supply slots through a thickness of the substrate. At least the select second area of the etch mask layer is removed from the substrate, whereby mask layer residue formed from the select second area of the etch mask layer is significantly reduced.
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subjects BASIC ELECTRIC ELEMENTS
CORRECTION OF TYPOGRAPHICAL ERRORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PRINTING
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SELECTIVE PRINTING MECHANISMS
SEMICONDUCTOR DEVICES
STAMPS
TRANSPORTING
TYPEWRITERS
title Method for making a micro-fluid ejection device
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