Leadless plastic chip carrier with etch back pad singulation

A leadless plastic chip carrier is constructed by half etching one or both sides of the package design onto a leadframe strip so as to create unique design features such as power and/or ground ring surrounding the die attach pad, interlocking rivet head construction for the contact pads, and an inte...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LAU WING HIM, TSANG KWOK CHEUNG, FAN CHUN HO, KWAN KIN PUI, MCLELLAN NEIL
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
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