Three-dimensional module comprised of layers containing IC chips with overlying interconnect layers

A pre-formed integrated circuit chip-containing module formed from layers is disclosed. Each layer contains an integrated circuit chip that is encapsulated into an electronic package, by forming an interconnect assembly separately from the pre-formed integrated circuit chip. If the interconnect asse...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PEPE ANGEL, YAMAGUCHI JAMES
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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