Torsion spring force and vertical shear pin retention of heat sink to CPU
A heat sink retention assembly for retaining a heat sink in thermal contact with a CPU while transmitting load away from the CPU. The heat sink retention assembly includes a frame sized to receive the heat sink, the frame including opposing pin capture channels and a wire module. The wire module inc...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | FRENCH MICHAEL D HERRING DEAN F BARINA RICHARD M SCAVUZZO JOHN P WORMSBECHER PAUL A |
description | A heat sink retention assembly for retaining a heat sink in thermal contact with a CPU while transmitting load away from the CPU. The heat sink retention assembly includes a frame sized to receive the heat sink, the frame including opposing pin capture channels and a wire module. The wire module includes an upper handle section and a lower pivoting section. The wire module is pivotably coupled to the frame at the lower pivoting section. The wire module further includes opposing end pins, wherein each pin is moveably retained within and extends through a corresponding pin capture channel such that when the wire module is rotated with respect to the frame, the pins travel within their respective channels in order to engage the heat sink. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US7236369B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US7236369B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US7236369B23</originalsourceid><addsrcrecordid>eNqNykEKwjAQRuFsXIh6h_8CbhqouLUouhNs1yXEiYaWmTATPL8KHsDVg8e3dJde1LIwrGjmB5JoJAS-40Vacwwz7ElBUTJDqRLXr5aEz62wzBOqoLsOa7dIYTba_LpyOB377rylIiNZCZGY6jjcdo1vfbs_NP4P8gZHQTPQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Torsion spring force and vertical shear pin retention of heat sink to CPU</title><source>esp@cenet</source><creator>FRENCH MICHAEL D ; HERRING DEAN F ; BARINA RICHARD M ; SCAVUZZO JOHN P ; WORMSBECHER PAUL A</creator><creatorcontrib>FRENCH MICHAEL D ; HERRING DEAN F ; BARINA RICHARD M ; SCAVUZZO JOHN P ; WORMSBECHER PAUL A</creatorcontrib><description>A heat sink retention assembly for retaining a heat sink in thermal contact with a CPU while transmitting load away from the CPU. The heat sink retention assembly includes a frame sized to receive the heat sink, the frame including opposing pin capture channels and a wire module. The wire module includes an upper handle section and a lower pivoting section. The wire module is pivotably coupled to the frame at the lower pivoting section. The wire module further includes opposing end pins, wherein each pin is moveably retained within and extends through a corresponding pin capture channel such that when the wire module is rotated with respect to the frame, the pins travel within their respective channels in order to engage the heat sink.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070626&DB=EPODOC&CC=US&NR=7236369B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20070626&DB=EPODOC&CC=US&NR=7236369B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FRENCH MICHAEL D</creatorcontrib><creatorcontrib>HERRING DEAN F</creatorcontrib><creatorcontrib>BARINA RICHARD M</creatorcontrib><creatorcontrib>SCAVUZZO JOHN P</creatorcontrib><creatorcontrib>WORMSBECHER PAUL A</creatorcontrib><title>Torsion spring force and vertical shear pin retention of heat sink to CPU</title><description>A heat sink retention assembly for retaining a heat sink in thermal contact with a CPU while transmitting load away from the CPU. The heat sink retention assembly includes a frame sized to receive the heat sink, the frame including opposing pin capture channels and a wire module. The wire module includes an upper handle section and a lower pivoting section. The wire module is pivotably coupled to the frame at the lower pivoting section. The wire module further includes opposing end pins, wherein each pin is moveably retained within and extends through a corresponding pin capture channel such that when the wire module is rotated with respect to the frame, the pins travel within their respective channels in order to engage the heat sink.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNykEKwjAQRuFsXIh6h_8CbhqouLUouhNs1yXEiYaWmTATPL8KHsDVg8e3dJde1LIwrGjmB5JoJAS-40Vacwwz7ElBUTJDqRLXr5aEz62wzBOqoLsOa7dIYTba_LpyOB377rylIiNZCZGY6jjcdo1vfbs_NP4P8gZHQTPQ</recordid><startdate>20070626</startdate><enddate>20070626</enddate><creator>FRENCH MICHAEL D</creator><creator>HERRING DEAN F</creator><creator>BARINA RICHARD M</creator><creator>SCAVUZZO JOHN P</creator><creator>WORMSBECHER PAUL A</creator><scope>EVB</scope></search><sort><creationdate>20070626</creationdate><title>Torsion spring force and vertical shear pin retention of heat sink to CPU</title><author>FRENCH MICHAEL D ; HERRING DEAN F ; BARINA RICHARD M ; SCAVUZZO JOHN P ; WORMSBECHER PAUL A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7236369B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>FRENCH MICHAEL D</creatorcontrib><creatorcontrib>HERRING DEAN F</creatorcontrib><creatorcontrib>BARINA RICHARD M</creatorcontrib><creatorcontrib>SCAVUZZO JOHN P</creatorcontrib><creatorcontrib>WORMSBECHER PAUL A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FRENCH MICHAEL D</au><au>HERRING DEAN F</au><au>BARINA RICHARD M</au><au>SCAVUZZO JOHN P</au><au>WORMSBECHER PAUL A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Torsion spring force and vertical shear pin retention of heat sink to CPU</title><date>2007-06-26</date><risdate>2007</risdate><abstract>A heat sink retention assembly for retaining a heat sink in thermal contact with a CPU while transmitting load away from the CPU. The heat sink retention assembly includes a frame sized to receive the heat sink, the frame including opposing pin capture channels and a wire module. The wire module includes an upper handle section and a lower pivoting section. The wire module is pivotably coupled to the frame at the lower pivoting section. The wire module further includes opposing end pins, wherein each pin is moveably retained within and extends through a corresponding pin capture channel such that when the wire module is rotated with respect to the frame, the pins travel within their respective channels in order to engage the heat sink.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US7236369B2 |
source | esp@cenet |
subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | Torsion spring force and vertical shear pin retention of heat sink to CPU |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T12%3A21%3A57IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=FRENCH%20MICHAEL%20D&rft.date=2007-06-26&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS7236369B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |