Integrated circuit package

A packaged IC includes an IC die with signal and signal complement traces positioned relative to each other to maximize broadside coupling for a matching impedance. The signal and signal complement traces are electrically connected to transmission or receive channels of the IC die. Use of a broadsid...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DEVNANI NURWATI S, BARNES JAMES OLIVER, LAI BENNY W H, MOORE CHARLES E
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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