Selecting dice to test using a yield map

Dice on a wafer are selected to be tested using a yield map. The yield map incorporates yield information of different products produced by the same fabrication process. A die placement for a product to be produced by the same process is determined based on the yield map. An expected yield for a die...

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1. Verfasser:	CADOURI EITAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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