System and method for thermal monitoring of IC using sampling periods of invariant duration

A system and method are provided for monitoring temperature within a specified integrated circuit. Usefully, the system comprises at least one oscillator device proximate to the integrated circuit for generating signal pulses at a frequency that varies as a function of the temperature adjacent to th...

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Hauptverfasser: LAZARUS ASHER SHLOMO, MONWAI BRIAN CHAN, FLOYD MICHAEL STEPHEN
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creator LAZARUS ASHER SHLOMO
MONWAI BRIAN CHAN
FLOYD MICHAEL STEPHEN
description A system and method are provided for monitoring temperature within a specified integrated circuit. Usefully, the system comprises at least one oscillator device proximate to the integrated circuit for generating signal pulses at a frequency that varies as a function of the temperature adjacent to the oscillator device. The system further comprises a control unit for establishing sample acquisition periods of invariant time duration based on an time invariant reference clock. A sampling component is coupled to count the number of pulses generated by the oscillator device during each of a succession of the time invariant sample acquisition periods, and a threshold component responsive to the respective count values for the succession of sample acquisition periods provides notice when at least some of the count values have a value associated with a prespecified excessive temperature level.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US7197419B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US7197419B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US7197419B23</originalsourceid><addsrcrecordid>eNqNikEKwjAQAHPxIOof9gMeqkLp1aLouXryUBazsYFkNyRbwd9LwAd4moGZpXkMn6IUAdlCJJ3EgpMMOlGOGCAKe5Xs-QXi4NrDXKoXjClUSZS92FKj5zdmj6xg54zqhddm4TAU2vy4MnA-3frLlpKMVBI-iUnH-9A2XXtouuNu_8fyBfYgO1I</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>System and method for thermal monitoring of IC using sampling periods of invariant duration</title><source>esp@cenet</source><creator>LAZARUS ASHER SHLOMO ; MONWAI BRIAN CHAN ; FLOYD MICHAEL STEPHEN</creator><creatorcontrib>LAZARUS ASHER SHLOMO ; MONWAI BRIAN CHAN ; FLOYD MICHAEL STEPHEN</creatorcontrib><description>A system and method are provided for monitoring temperature within a specified integrated circuit. Usefully, the system comprises at least one oscillator device proximate to the integrated circuit for generating signal pulses at a frequency that varies as a function of the temperature adjacent to the oscillator device. The system further comprises a control unit for establishing sample acquisition periods of invariant time duration based on an time invariant reference clock. A sampling component is coupled to count the number of pulses generated by the oscillator device during each of a succession of the time invariant sample acquisition periods, and a threshold component responsive to the respective count values for the succession of sample acquisition periods provides notice when at least some of the count values have a value associated with a prespecified excessive temperature level.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; MEASURING ; MEASURING QUANTITY OF HEAT ; MEASURING TEMPERATURE ; PHYSICS ; SEMICONDUCTOR DEVICES ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS ; TESTING ; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20070327&amp;DB=EPODOC&amp;CC=US&amp;NR=7197419B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20070327&amp;DB=EPODOC&amp;CC=US&amp;NR=7197419B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LAZARUS ASHER SHLOMO</creatorcontrib><creatorcontrib>MONWAI BRIAN CHAN</creatorcontrib><creatorcontrib>FLOYD MICHAEL STEPHEN</creatorcontrib><title>System and method for thermal monitoring of IC using sampling periods of invariant duration</title><description>A system and method are provided for monitoring temperature within a specified integrated circuit. Usefully, the system comprises at least one oscillator device proximate to the integrated circuit for generating signal pulses at a frequency that varies as a function of the temperature adjacent to the oscillator device. The system further comprises a control unit for establishing sample acquisition periods of invariant time duration based on an time invariant reference clock. A sampling component is coupled to count the number of pulses generated by the oscillator device during each of a succession of the time invariant sample acquisition periods, and a threshold component responsive to the respective count values for the succession of sample acquisition periods provides notice when at least some of the count values have a value associated with a prespecified excessive temperature level.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>MEASURING</subject><subject>MEASURING QUANTITY OF HEAT</subject><subject>MEASURING TEMPERATURE</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS</subject><subject>TESTING</subject><subject>THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNikEKwjAQAHPxIOof9gMeqkLp1aLouXryUBazsYFkNyRbwd9LwAd4moGZpXkMn6IUAdlCJJ3EgpMMOlGOGCAKe5Xs-QXi4NrDXKoXjClUSZS92FKj5zdmj6xg54zqhddm4TAU2vy4MnA-3frLlpKMVBI-iUnH-9A2XXtouuNu_8fyBfYgO1I</recordid><startdate>20070327</startdate><enddate>20070327</enddate><creator>LAZARUS ASHER SHLOMO</creator><creator>MONWAI BRIAN CHAN</creator><creator>FLOYD MICHAEL STEPHEN</creator><scope>EVB</scope></search><sort><creationdate>20070327</creationdate><title>System and method for thermal monitoring of IC using sampling periods of invariant duration</title><author>LAZARUS ASHER SHLOMO ; MONWAI BRIAN CHAN ; FLOYD MICHAEL STEPHEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7197419B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>MEASURING</topic><topic>MEASURING QUANTITY OF HEAT</topic><topic>MEASURING TEMPERATURE</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS</topic><topic>TESTING</topic><topic>THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</topic><toplevel>online_resources</toplevel><creatorcontrib>LAZARUS ASHER SHLOMO</creatorcontrib><creatorcontrib>MONWAI BRIAN CHAN</creatorcontrib><creatorcontrib>FLOYD MICHAEL STEPHEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LAZARUS ASHER SHLOMO</au><au>MONWAI BRIAN CHAN</au><au>FLOYD MICHAEL STEPHEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>System and method for thermal monitoring of IC using sampling periods of invariant duration</title><date>2007-03-27</date><risdate>2007</risdate><abstract>A system and method are provided for monitoring temperature within a specified integrated circuit. Usefully, the system comprises at least one oscillator device proximate to the integrated circuit for generating signal pulses at a frequency that varies as a function of the temperature adjacent to the oscillator device. The system further comprises a control unit for establishing sample acquisition periods of invariant time duration based on an time invariant reference clock. A sampling component is coupled to count the number of pulses generated by the oscillator device during each of a succession of the time invariant sample acquisition periods, and a threshold component responsive to the respective count values for the succession of sample acquisition periods provides notice when at least some of the count values have a value associated with a prespecified excessive temperature level.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
MEASURING
MEASURING QUANTITY OF HEAT
MEASURING TEMPERATURE
PHYSICS
SEMICONDUCTOR DEVICES
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
TESTING
THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
title System and method for thermal monitoring of IC using sampling periods of invariant duration
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T22%3A32%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LAZARUS%20ASHER%20SHLOMO&rft.date=2007-03-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS7197419B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true