Ultra-thin wafer level stack packaging method

A method of forming an ultra-thin wafer level stack package and structure thereof are provided. The method includes providing a first wafer having a plurality of base chips thereon, selectively binding the first wafer to a second substrate, lapping the first wafer to reduce its thickness, dicing the...

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Bibliographische Detailangaben

1. Verfasser:	HSUAN MINIH
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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