Integrated circuit card and a method of manufacturing the same

Integrated circuit card and a method of manufacturing the same

A multi-function structure of a plug-in universal IC card is to be promoted and the manufacturing cost is to be reduced. The body of the plug-in UICC is constructed of a molding resin. A tape substrate and a chip mounted on one side of the tape substrate are sealed in the interior of the molding res...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TANAKA HIROAKI, ONOZAWA AKIRA, YAMADA NOBUAKI, KURATOMI BUNSHI, SUZUKI KAZUNARI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
BOOK COVERS
BOOKBINDING
CALCULATING
COMPUTING
COUNTING
DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FILES
HANDLING RECORD CARRIERS
LOOSE LEAVES
MOVABLE-STRIP WRITING OR READING APPARATUS
PERFORMING OPERATIONS
PHYSICS
PRESENTATION OF DATA
PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES
PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
SPECIAL PRINTED MATTER
TRANSPORTING
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Beschreibung
Zusammenfassung:A multi-function structure of a plug-in universal IC card is to be promoted and the manufacturing cost is to be reduced. The body of the plug-in UICC is constructed of a molding resin. A tape substrate and a chip mounted on one side of the tape substrate are sealed in the interior of the molding resin. A side opposite to the chip mounting side of the tape substrate is exposed to the exterior of the molding resin and constitutes a surface portion of the plug-in UICC. Contact patterns serving as external terminals of the plug-in UICC are formed on the surface of the tape substrate exposed to the exterior of the molding resin. In the plug-in UICC whose body is constructed of molding resin, cracking of the chip can be prevented effectively even in the case where the chip is large-sized.