Electron microscopic inspection apparatus
Both wafers on which copper wiring was performed and wafers on which non-copper wiring was performed can be inspected by a single unit of electron microscopic inspection apparatus with no possibilities of the wafers being contaminated with copper. All elements within the apparatus that come in conta...
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creator | OTAKA TADASHI SHIRAKIHARA MANABU TAKAMI SHO |
description | Both wafers on which copper wiring was performed and wafers on which non-copper wiring was performed can be inspected by a single unit of electron microscopic inspection apparatus with no possibilities of the wafers being contaminated with copper. All elements within the apparatus that come in contact with wafers, such as hands of a wafer transporter, are duplicated or more and one of the elements that contact wafers is used appropriately for the wafers under inspection which may be either the wafers on which copper wiring was performed or the wafers on which non-copper wiring was performed. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US7091496B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US7091496B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US7091496B23</originalsourceid><addsrcrecordid>eNrjZNB0zUlNLinKz1PIzUwuyi9Ozi_ITFbIzCsuAApnAoUTCwoSixJLSot5GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakl8aLC5gaWhiaWZk5ExEUoA_e4pLg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electron microscopic inspection apparatus</title><source>esp@cenet</source><creator>OTAKA TADASHI ; SHIRAKIHARA MANABU ; TAKAMI SHO</creator><creatorcontrib>OTAKA TADASHI ; SHIRAKIHARA MANABU ; TAKAMI SHO</creatorcontrib><description>Both wafers on which copper wiring was performed and wafers on which non-copper wiring was performed can be inspected by a single unit of electron microscopic inspection apparatus with no possibilities of the wafers being contaminated with copper. All elements within the apparatus that come in contact with wafers, such as hands of a wafer transporter, are duplicated or more and one of the elements that contact wafers is used appropriately for the wafers under inspection which may be either the wafers on which copper wiring was performed or the wafers on which non-copper wiring was performed.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CONVEYING ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HANDLING THIN OR FILAMENTARY MATERIAL ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PACKING ; PERFORMING OPERATIONS ; PHYSICS ; PNEUMATIC TUBE CONVEYORS ; SEMICONDUCTOR DEVICES ; SHOP CONVEYOR SYSTEMS ; STORING ; TESTING ; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING ; TRANSPORTING</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060815&DB=EPODOC&CC=US&NR=7091496B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060815&DB=EPODOC&CC=US&NR=7091496B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OTAKA TADASHI</creatorcontrib><creatorcontrib>SHIRAKIHARA MANABU</creatorcontrib><creatorcontrib>TAKAMI SHO</creatorcontrib><title>Electron microscopic inspection apparatus</title><description>Both wafers on which copper wiring was performed and wafers on which non-copper wiring was performed can be inspected by a single unit of electron microscopic inspection apparatus with no possibilities of the wafers being contaminated with copper. All elements within the apparatus that come in contact with wafers, such as hands of a wafer transporter, are duplicated or more and one of the elements that contact wafers is used appropriately for the wafers under inspection which may be either the wafers on which copper wiring was performed or the wafers on which non-copper wiring was performed.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CONVEYING</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HANDLING THIN OR FILAMENTARY MATERIAL</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PACKING</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PNEUMATIC TUBE CONVEYORS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHOP CONVEYOR SYSTEMS</subject><subject>STORING</subject><subject>TESTING</subject><subject>TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB0zUlNLinKz1PIzUwuyi9Ozi_ITFbIzCsuAApnAoUTCwoSixJLSot5GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakl8aLC5gaWhiaWZk5ExEUoA_e4pLg</recordid><startdate>20060815</startdate><enddate>20060815</enddate><creator>OTAKA TADASHI</creator><creator>SHIRAKIHARA MANABU</creator><creator>TAKAMI SHO</creator><scope>EVB</scope></search><sort><creationdate>20060815</creationdate><title>Electron microscopic inspection apparatus</title><author>OTAKA TADASHI ; SHIRAKIHARA MANABU ; TAKAMI SHO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US7091496B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CONVEYING</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HANDLING THIN OR FILAMENTARY MATERIAL</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PACKING</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>PNEUMATIC TUBE CONVEYORS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHOP CONVEYOR SYSTEMS</topic><topic>STORING</topic><topic>TESTING</topic><topic>TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>OTAKA TADASHI</creatorcontrib><creatorcontrib>SHIRAKIHARA MANABU</creatorcontrib><creatorcontrib>TAKAMI SHO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OTAKA TADASHI</au><au>SHIRAKIHARA MANABU</au><au>TAKAMI SHO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electron microscopic inspection apparatus</title><date>2006-08-15</date><risdate>2006</risdate><abstract>Both wafers on which copper wiring was performed and wafers on which non-copper wiring was performed can be inspected by a single unit of electron microscopic inspection apparatus with no possibilities of the wafers being contaminated with copper. All elements within the apparatus that come in contact with wafers, such as hands of a wafer transporter, are duplicated or more and one of the elements that contact wafers is used appropriately for the wafers under inspection which may be either the wafers on which copper wiring was performed or the wafers on which non-copper wiring was performed.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CONVEYING ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PACKING PERFORMING OPERATIONS PHYSICS PNEUMATIC TUBE CONVEYORS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TESTING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING |
title | Electron microscopic inspection apparatus |
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