Semiconductor packaging techniques for use with non-ceramic packages

A method for attaching at least one IC die to a non-ceramic IC package including a leadframe and a base, the IC package being configured for receiving the at least one IC die, includes attaching the IC die to an upper surface of a thermal carrier in a manner which facilitates thermal transfer betwee...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FREUND JOSEPH MICHAEL, MILLER CURTIS JAMES, BRENNAN JOHN MCKENNA, SHANAMAN, III RICHARD HANDLY
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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