Building metal pillars in a chip for structure support

Stacked via pillars, such as metal via pillars, are provided at different and designated locations in IC chips to support the chip structure during processing and any related processing stresses such as thermal and mechanical stresses. These stacked via pillars connect and extend from a base substra...

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Bibliographische Detailangaben

Hauptverfasser:	MURRAY CONAL E, LIU XIAO H, MCGAHAY VINCENT J, SHAW THOMAS M, NAYAK JAWAHAR P, HICHRI HABIB
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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