Method of manufacturing a laser diode package

A laser diode package includes a heat sink, a laser diode, and an electrically nonconductive (i.e. insulative) substrate. The laser diode has an emitting surface and a reflective surface opposing the emitting surface. The laser diode further has first and second side surfaces between the emitting an...

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Bibliographische Detailangaben
1. Verfasser: STEPHENS EDWARD F
Format: Patent
Sprache:eng
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