Multi chip module assembly

A method of assembling at least a first integrated circuit and a second integrated circuit into a multi chip module. The first integrated circuit is attached and electrically connected to a first substrate to form a first assembly, which is tested to ensure that it functions properly. The second int...

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Hauptverfasser:	RAJAGOPALAN SARATHY, MCCORMICK JOHN P, ALAGARATNAM MANIAM, DESAI KISHOR
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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creator	RAJAGOPALAN SARATHY MCCORMICK JOHN P ALAGARATNAM MANIAM DESAI KISHOR
description	A method of assembling at least a first integrated circuit and a second integrated circuit into a multi chip module. The first integrated circuit is attached and electrically connected to a first substrate to form a first assembly, which is tested to ensure that it functions properly. The second integrated circuit is attached and electrically connected to a second substrate to form a second assembly, which is also tested to ensure that it functions properly. The first assembly is attached and electrically connected to the second assembly to form the multi chip module.
format	Patent
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
title	Multi chip module assembly
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