Method of forming segmented ball limiting metallurgy

Method of forming segmented ball limiting metallurgy

The present invention discloses a novel layout and process for a device with segmented BLM for the I/Os. In a first embodiment, each BLM is split into two segments. The segments are close to each other and connected to the same overlying bump. In a second embodiment, each BLM is split into more than...

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1. Verfasser: SESHAN KRISHNA
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SESHAN KRISHNA
description The present invention discloses a novel layout and process for a device with segmented BLM for the I/Os. In a first embodiment, each BLM is split into two segments. The segments are close to each other and connected to the same overlying bump. In a second embodiment, each BLM is split into more than two segments. In a third embodiment, each segment is electrically connected to more than one underlying via. In a fourth embodiment, each segment is electrically connected to more than one underlying bond pad.
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The segments are close to each other and connected to the same overlying bump. In a second embodiment, each BLM is split into more than two segments. In a third embodiment, each segment is electrically connected to more than one underlying via. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method of forming segmented ball limiting metallurgy
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