Method of forming a semiconductor package and structure thereof

An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed by forming a conductive layer ( 42, 64 ) over a mold encapsulant ( 35, 62 ). The conductive layer ( 42, 64 ) may be electrically coupled using a wire to the leadframe ( 10, 52 ) of the semiconductor package ( 2,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SALIAN ARVIND S, CHAPMAN MICHAEL E, MAHADEVAN DAVE S
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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