Method of manufacturing semiconductor device having shallow trench isolation (STI)

A method of manufacturing a semiconductor device having a shallow trench isolation includes steps of forming a mask layer on a semiconductor substrate, forming a shallow trench in a semiconductor substrate using the mask layer, forming at least one step in the semiconductor substrate at the top of t...

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Bibliographische Detailangaben
1. Verfasser: KIM SUNG-HOAN
Format: Patent
Sprache:eng
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